TECOSIM Newsletter November 2014

Dear readers,

The most important CAE industry event, SIMVEC, is just around the corner on 18 and 19 November. As a market leader in this sector, TECOSIM will have a strong presence at the congress with an information booth and lectures on the new software Automex and on modelling laminated safety glass using XFEM. Our company is also sponsoring the evening event.

Are you planning to visit the congress in Baden-Baden? If so, we are looking forward to exchanging ideas with you at Booth 35 on the first floor. See our complete CAE service portfolio while testing our new software TEC|WRX and finding out about our virtual benchmarking process TEC|BENCH.

You are welcome to contact us at tecosim-auf-der-simvec@tecosim.com to make an appointment with the contact person that you wish to speak to.

Read more about our involvement at SIMVEC and the latest news from TECOSIM in our current newsletter.

We hope you enjoy reading it.

Best wishes,