22 and 23 November 2016. This VDI (Association of German Engineers) conference is where all the key decision-makers come together and learn about current trends during lectures, conversations and a trade exhibition. SIMVEC sees TECOSIM appearing under the slogan '25 Years CAE Pioneer'.
TECOSIM at SIMVEC. Image: VDI Wissensforum
In their lectures at SIMVEC, our speakers will be presenting innovative tools and methods which can be used to make everyday product development even more efficient:
FE based generation of modal substructure tire models for use in full vehicle NVH simulations
23 November 2016, 9.35 a.m., Room 1
TECOSIM has implemented in cooperation with HONDA an full vehicle project in which the predictive power of FE analyzes for sound pressure should be improved due to engine excitation. Since the tire with its spring and damper characteristics carries the entire vehicle and thus is affecting the oscillation behavior decisively, modal substructures of tires were defined as part of the improvements. For this, a 3D finite element model of the tire was created and correlated to modal tests. In addition, a cleat impact test was implemented and compared with calculation results of the 3D models.
A wide-ranging presentation of new and established products from the CAE specialists awaits congress participants at the TECOSIM exhibition booth. The focus is on:
TEC|CONCEPT
TTEC|CONCEPT is a pioneering development process which can be used to take into account a large number of framework conditions simultaneously during the early stage of development. The idea is to simplify or reduce a variety of complex requirements, such as quality, weight, rigidity, manufacturing feasibility, structural integrity and costs, into the early design concept stage of virtual development. The core element is an improved, faster use of the correlations between FEM, CAD and CAE data. You will find more information here.
TEC|BENCH
TECOSIM's virtual benchmarking process is celebrating its tenth anniversary and is more in demand than ever with clients who wish to provide information obtained from hardware as a CAE model directly in the development environment. Do you have a specific project in mind and would like to know how we work with TEC|BENCH? Our experts will be glad to advise you. You will find detailed information to begin with here.
We will be glad to arrange a personal meeting with you in advance for SIMVEC. Please send an email to tecosim-auf-der-simvec(at)tecosim.com
Our experts will also be available to you for unscheduled personal consultation during the congress. Simply visit us at Stand 35 on the upper floor, on the right-hand side immediately next to the entrance to Congress Hall I.
